发明名称 |
FORMING METHOD OF OXIDE SEMICONDUCTOR THIN FILM, OXIDE SEMICONDUCTOR TRANSISTER, AND FORMING METHOD OF THE SAME |
摘要 |
PURPOSE: A method of forming an oxide semiconductor thin film and an oxide semiconductor transistor are provided to simplify a process and increase thermal reliability by implementing a P-type semiconductor having electrical properties similar to a poly-crystal silicon. CONSTITUTION: A tin monoxide powder is sintered and the tin monoxide target is formed(S200). The tin monoxide target is mounted in a vacuum container(S210). A substrate is installed to a substrate holder(S220). The electricity is applied in the tin monoxide target(S230). The tin monoxide is evaporated in the substrate(S240). The deposited tin monoxide is heat-treated(S250).
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申请公布号 |
KR101139185(B1) |
申请公布日期 |
2012.04.26 |
申请号 |
KR20090072308 |
申请日期 |
2009.08.06 |
申请人 |
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发明人 |
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分类号 |
H01L21/203;H01L21/324;H01L29/786 |
主分类号 |
H01L21/203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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