发明名称 PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma processing method capable of removing Ti-based sediment on the surface of a processing chamber of a plasma processing apparatus without generating a foreign body such as an boronic oxide. <P>SOLUTION: The plasma processing method includes: product etching (step S1: processing of a sample including Ti material); thereafter carbon system deposition discharge for depositing a carbon system film on a Ti reaction product deposited on the surface of the processing chamber (step S2); and thereafter chlorine electric discharge for removing the carbon system film abd the Ti deposited on the surface of the processing chamber (step S3). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012084600(A) 申请公布日期 2012.04.26
申请号 JP20100227640 申请日期 2010.10.07
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 HIROTA KOSA
分类号 H01L21/3065 主分类号 H01L21/3065
代理机构 代理人
主权项
地址