LIGHT EMITTING DIODE PACKAGE

摘要

An LED package includes a substrate, an LED die and an encapsulation. The substrate includes a supporting surface and a protrusion extending from the supporting surface along a first direction. The protrusion includes a distal end portion extending along a second direction. The first direction and the second direction define a non-zero angle there between. The LED die is arranged on the supporting surface of the substrate. The encapsulation lies on the supporting surface and covers the LED die and the protrusion to increase a bonding connection between the encapsulation and the substrate.