| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the waste of a material composing a lead frame used in an optical coupling semiconductor device by cutting the center part of a portion that is used as tie bars for stopping resin flow during resin molding, simply bending both sides of the cut portion and using them as the external terminals of a package. <P>SOLUTION: Tie bars Ta and Tb provided in each element region of a lead frame and functioning as a sealing resin flow stopper when resin sealing are processed so that external terminals 25c, 24c and 23c, 22c of light-emitting elements Ee and light-receiving elements Re extending to the outside of a package are formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
