发明名称 ACTIVE ENERGY RAY-CURING HOT MELT URETHANE RESIN COMPOSITION, AND MEMBER FOR ELECTRONIC DEVICE AND PACKING USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an active energy ray-curing hot melt urethane resin composition, which has the hot melt property and a rapid curability by irradiation with ultraviolet rays or the like, and is excellent in shape retainability, flexibility, mechanical strength, hydrolysis resistance, adhesivity to a substrate, and outgassing, due to the improvement in the compatibility of a polyol. <P>SOLUTION: The active energy ray-curing hot melt urethane resin composition includes a (meth)acryloyl group-terminated hot melt urethane (X) and an active energy ray polymerization initiator (Y). The (meth)acryloyl group-terminated hot melt urethane (X) is prepared by reacting (A) a polyol containing (a1) an aromatic polyester polyol containing &ge;90 mol% of a glycol having a 2,2-dimethyl-1,3-propylene group in glycol components, (a2) a polyol other than the (a1) and the below (a3), and (a3) a bisphenol A-containing polyester polyol with (B) a polyisocyanate to thereby obtain (C) an NCO group-terminated urethane prepolymer, and making >50% and &le;100% of the total number of NCO groups thereof into terminal (meth)acryloyl groups by (D) a reactive functional group-containing (meth)acrylic compound to thereby obtain the (meth)acryloyl group-terminated hot melt urethane (X). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012082366(A) 申请公布日期 2012.04.26
申请号 JP20100231490 申请日期 2010.10.14
申请人 DIC CORP 发明人 KANEKAWA YOSHINORI;HIGUCHI DAICHI;SAKAMOTO TAMOTSU
分类号 C08G18/67;C08G18/42;F16J15/14 主分类号 C08G18/67
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