| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-quality bonded substrate without air bubbles between a silicon substrate and a glass substrate. <P>SOLUTION: The present invention concerns a method for bonding a first substrate 1a having a first surface 2a to a second substrate 1b having a second surface 2b. This method includes steps of: holding the first substrate 1a by at least two support points S1, S2; positioning the first substrate 1a and the second substrate 1b so that the first surface 2a and the second surface 2b face each other; deforming the first substrate 1a by applying, between at least one pressure point P1 and the two support points S1, S2, a strain F toward the second substrate 1b; bringing the deformed first surface 2a and the second surface 2b into contact; and progressively releasing the strain F. <P>COPYRIGHT: (C)2012,JPO&INPIT |
