发明名称 |
ELEMENT MOUNTING SUBSTRATE AND SEMICONDUCTOR MODULE |
摘要 |
Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics.
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申请公布号 |
US2012098137(A1) |
申请公布日期 |
2012.04.26 |
申请号 |
US201013381299 |
申请日期 |
2010.06.30 |
申请人 |
USUI RYOSUKE;IGARASHI YUSUKE;INOUE YASUNORI;NAKASATO MAYUMI;NAGAMATSU MASAYUKI;KOHARA YASUHIRO |
发明人 |
USUI RYOSUKE;IGARASHI YUSUKE;INOUE YASUNORI;NAKASATO MAYUMI;NAGAMATSU MASAYUKI;KOHARA YASUHIRO |
分类号 |
H01L29/43;H01L23/48;H05K7/20 |
主分类号 |
H01L29/43 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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