| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sheet which can be thinned, has both sides having different purposes of use, functions, performances, characteristics or the like, the one side surface having excellent grooving performance and adhesion with a conductive layer and allowing a microcircuit to be formed thereon, and to provide a laminated plate, electronic component, a print wiring board and a semiconductor device produced by using the resin sheet. <P>SOLUTION: The resin sheet has a multilayer structure including a first resin layer forming one surface side and a second resin layer forming the other surface side. The first resin layer contains at least a curable resin, and the second resin layer contains a thermosetting resin and inorganic filler and has a thickness of 5 to 30 μm. <P>COPYRIGHT: (C)2012,JPO&INPIT |
