LIGHT EMITTING ELEMENT PACKAGE

摘要

A light emitting element package includes a substrate, a light emitting element, and a package member. The substrate includes a first solder pad and a second solder pad. The light emitting element is mounted on the substrate and includes a p-type electrode and an n-type electrode. The package member is configured for enveloping the light emitting element. A first electrode and a second electrode are formed on the package member. The first electrode and the second electrode of the package member are electrically coupled to the p-type electrode and the n-type electrode of the light emitting element. The first electrode and the second electrode of the package member are electrically coupled to the first solder pad and the second solder pad of the substrate.