Method of manufacturing a wiring board including electroplating,申请号EP20050011695-传众专利搜索

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发明名称	Method of manufacturing a wiring board including electroplating
摘要
申请公布号	EP1619719(B1)	申请公布日期	2012.04.25
申请号	EP20050011695	申请日期	2005.05.31
申请人	SHINKO ELECTRIC INDUSTRIES CO., LTD.	发明人	MIYAGAWA, HIROSHI;KARASAWA, TAKAAKI;WAKABAYASHI, HIDEYUKI
分类号	H05K3/24	主分类号	H05K3/24
代理机构		代理人
主权项
地址

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