发明名称 |
Photosensitive composition, method for forming pattern, and method for manufacturing semiconductor device |
摘要 |
The present invention relates to a photosensitive composition, which is capable of being irradiated with high energy beam having a wave length of 1 to 300 nm band. The photosensitive composition includes a binder resin; and a photoelectron absorbent, capable of being excited with photoelectron emitted from the binder resin that absorbs the high energy beam, when the binder resin is irradiated with the high energy beam.
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申请公布号 |
US8163462(B2) |
申请公布日期 |
2012.04.24 |
申请号 |
US20090457650 |
申请日期 |
2009.06.17 |
申请人 |
TORIUMI MINORU;ITANI TOSHIRO;RENESAS ELECTRONICS CORPORATION |
发明人 |
TORIUMI MINORU;ITANI TOSHIRO |
分类号 |
G02F7/00;G03F7/004;G03F7/028 |
主分类号 |
G02F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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