| 摘要 |
The invention relates to a method and a device (10) for the heat treatment of workpieces (19) or components, especially for producing a soldered connection between a solder material and at least one component or workpiece used as a solder material carrier by melting the solder material arranged on the solder material carrier. According to the invention, the heating and subsequent cooling of at least one component is carried out in a process chamber (13, 14) sealed from the outer surroundings. The component (19) is heated and cooled in two regions (13, 14) of the process chamber (12), which can be separated from each other by a condensation device (15).
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