METHOD OF MANUFACTURING BLOCK MODULE

摘要

PURPOSE: A method for manufacturing a block module is provided to simplify a ground process of a metal coating layer by connecting a ground terminal to the metal coating layer using a lead frame. CONSTITUTION: An electronic component(120) is mounted on a base substrate(110) with a ground terminal(112). A lead frame(130) is extended from the ground terminal to the outside of the base substrate. A circuit layer of the base substrate is connected to a flexible printed circuit(140). A mold(150) surrounds the base substrate. A cut part of the lead frame is exposed to the outside of the mold by cutting the lead frame. A metal coating layer(160) connected to the lead frame is formed in the mold.