发明名称 APPARATUS FOR AND METHODS OF ATTACHING HEAT SLUGS TO PACKAGE TOPS
摘要 A frame includes heat slug pads coupled together in a N×M matrix such that singulation of the heat slug pads consists of one or more parallel passes across the frame. Each heat slug pad has a top exposed surface and a bottom interfacing surface. The bottom interfacing surface typically interfaces with a package. In some embodiments, the top exposed surface is modified. Alternatively, the bottom interfacing surface is modified. Alternatively, both surfaces are modified. A modified top exposed surface can include a pattern to increase the top exposed surface area. A modified bottom interfacing surface can include a pattern to increase the bottom interfacing surface area, provide reference points, or both. Alternatively or in addition to, the modified bottom interfacing surface can be plated to increase the bottom interfacing surface area. A patterned surface can be obtained via a stamping process or an etching process.
申请公布号 US2012094438(A1) 申请公布日期 2012.04.19
申请号 US201113333897 申请日期 2011.12.21
申请人 SIRINORAKUL SARAVUTH;UTAC THAI LIMITED 发明人 SIRINORAKUL SARAVUTH
分类号 H01L21/60;H01L21/48;H01L23/495 主分类号 H01L21/60
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