| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component built-in printed circuit board which can be mounted at high density, multilayered, and manufactured at low costs easily, and its manufacturing method. <P>SOLUTION: An opening 12 penetrating from one main surface of a core material 11 to the other main surface is formed, and a function element 13 pressure-welded to a side wall of the opening 12 is mounted. Both terminals 13a, 13b of the function element 13 are exposed toward one main surface and the other main surface of the core material 11. An interlayer insulation layer 14 is formed on one main surface of the core material 11, and a first conductor bump 15 is connected to the terminal 13a, and electrically extracted to a first conductor layer 16. Similarly, a second interlayer insulation layer 17 is formed on the other main surface of the core material 11, and a second conductor bump 18 is connected to the terminal 13b, and electrically extracted to a second conductor layer 19. Also, the first interlayer insulation layer 14 and the second interlayer insulation layer 17 fill a cavity generated between the opening 12 and the function element 13. <P>COPYRIGHT: (C)2012,JPO&INPIT |
