| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for packaging a conduction cooled package laser which reduces influence caused by high heat in a manufacturing process to semiconductor laser characteristics, and reduces embrittlement and fracture caused by a semiconductor laser. <P>SOLUTION: In the packaging method and the structure of the conduction cooled package laser 200, the method includes a step of welding a semiconductor laser element 210 to a first heat spreader 230, and a step of fixing the first heat spreader 230 to a second heat spreader 250 with an aluminum-nickel multilayer thin film composite material 240. <P>COPYRIGHT: (C)2012,JPO&INPIT |
