| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multi-unit wiring board, along with a method of manufacturing same, in which occurrence of crack and flash on a wall surface of a frame body is suppressed when divided into individual pieces (for each package for storing electronic component). <P>SOLUTION: The multi-unit wiring board includes a ceramic base body 1 containing a plurality of wiring board regions, and a frame body 2 made from a baked body of insulating paste which is provided upright to bridge the peripheral edges of adjoining wiring board regions 11, along a border line 12 between the wiring board regions 11 of the ceramic base body 1. A dividing groove 21 for division in respective wiring board regions 11 is provided on the upper surface of the frame body 2. Relating to the frame body 2, a surface layer part 22 and the inner part 23, at least containing a region on the border line between the wiring board regions, are made from different materials from each other. The strength of formation material of the inner part 23 is lower than the strength of formation material of the surface layer part 22. The dividing groove 21 is formed from the surface layer part 22 to the inner part 23. <P>COPYRIGHT: (C)2012,JPO&INPIT |
