| 摘要 |
<p>The purpose of the present invention is to obtain a laser processing device and a laser processing method, which are capable of cutting an object to be processed with a thickness using a laser having a short wavelength. A laser processing device (10) applies a YAG-based laser focused by a first application unit (14) to an object to be processed (12), and applies a CO2 laser focused by a second application unit (16) and having a longer wavelength than the YAG-based laser to a region, to which the YAG-based laser is applied, of the object to be processed (12). More specifically, the YAG-based laser melts metal that constitutes the object to be processed (12), and the CO2 laser having higher plasma absorptivity than the YAG-based laser increases the temperature of the molten metal. As a result, the temperature of the molten metal becomes high, and the viscosity of the molten metal can be lowered to such an extent that the molten metal is blown off by assist gas.</p> |
