| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of preventing an upper or lower mold from biting into a lead frame and preventing a mold resin from sticking to a lead frame terminal. <P>SOLUTION: A manufacturing method of a semiconductor device comprises: a step of placing the lead frame on a depression of a lower mold; a step of superimposing the lower and upper molds and sliding the lead frame in a direction of the implantation surface which serves as the sides of the depressions of the lower and upper molds and on which the gate to be implanted with a resin is formed by means for sliding the lead frame; a step of clamping the lower and upper molds, crushing the end of the lead frame with the projection formed on the upper mold, and forming an overhanging part which fills the portion between the implantation surface and the lead frame on the right and left sides of the gate; and a step of implanting a mold resin from the gate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
