| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress the occurrence of breakage of an insulating film due to stress in mounting a semiconductor device, even when a solder ball consists of lead-free solder. <P>SOLUTION: The semiconductor device according to the present embodiment includes an electrode (an electrode pad 7) and the insulating film (for example, a protective resin film 5) formed on the electrode and having an opening 5a for exposing the electrode. The semiconductor device also includes an under-bump metal (an UBM layer 3) formed on the insulating film and connected to the electrode through the opening 5a, and a solder ball 1 formed on the under-bump metal. An outline 1a of a lower end of the solder ball 1 is positioned inside an outline 3a of the under-bump metal. <P>COPYRIGHT: (C)2012,JPO&INPIT |
