| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition and a resin sheet good in adhesiveness to an adherend member, and providing a cured material thereof excellent in water resistance and moisture resistance. <P>SOLUTION: The resin composition and the resin sheet are each used for adhering a heat conductor having a thermal conductivity of ≥10 W/m-K to an electroconductive layer. The resin composition and the resin sheet each comprise a curable compound having an epoxy group and an oxetane group, a curing agent, a filler, a first silane coupling agent having an epoxy group, and a second silane coupling agent having a 4C-12C alkyl group. The resin sheet further comprises, in addition to the above components, a polymer having a weight-average molecular weight of ≥10,000. <P>COPYRIGHT: (C)2012,JPO&INPIT |
