发明名称 Mehrfachschutzschichten zur Passivierung von Halbleiterbauelementen und Verfahren zu ihrer Herstellung
摘要 1285597 Semi-conductor devices INTERNATIONAL BUSINESS MACHINES CORP 13 Nov 1969 [25Nov 1968] 55555/69 Heading HlK Insulation on the body of a semi-conductor device includes a layer of silicon nitride (upon which lie conductors connected to the device) and a layer of glass, the layer of silicon nitride being closer to the semi-conductor. The NPN transistor shown has on its surface a layer 16 of silicon oxide or alumina which is covered by a silicon nitride layer 19. The glass layer 23 (which may be of phosphosilicate glass or of many other glasses including the following silicate glasses :- lead, soda, soda-lime, borosilicate, and aluminosilicate) as shown protects the conductors 21 and contacts 22 of Al, Pt, Pd, Mo, Cr-Ag-Cr, or Ti-Ag-Cr. The nitride layer may instead be in direct contact with the semi-conductor; there may be intervening insulative layers between the nitride and glass layers; and there may be further insulating layers (e.g. of glass), and contact layers, beyond the glass layer.
申请公布号 DE1958800(A1) 申请公布日期 1970.07.09
申请号 DE19691958800 申请日期 1969.11.22
申请人 INTERNATIONAL BUSINESS MACHINES CORP. 发明人 DUFFY,MICHAEL;RISEMAN,JACOB;WU,BEVAN
分类号 H01L23/29 主分类号 H01L23/29
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