| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a semiconductor module which enables a solid state imaging module to be mounted easily and securely with a mounting surface of a mounting substrate and the solid state imaging module maintained in a horizontal state and prevents image defects while maintaining bonding strengh of solder between wiring of the mounting substrate and a terminal of a solid state imaging device and heat radiation effect in the solid imaging module in which the solid image device is mounted on the mounting substrate. <P>SOLUTION: A mounting substrate 102 has recessed parts 107, each of which is formed so as to position a pearl ball (spacer member) 105 on its surface. A semiconductor device 104 is disposed on the mounting substrate 102 so that a bottom surface of the semiconductor device 104 contacts with the pearl balls 105 which are respectively disposed in the recessed parts 107 of the mounting substrate 102. <P>COPYRIGHT: (C)2012,JPO&INPIT |
