发明名称 LASER MACHINING DEVICE AND LASER MACHINING METHOD
摘要 The controllability of modified spots is improved. A laser processing apparatus 100 comprises a first laser light source 101 for emitting a first pulsed laser light L1, a second laser light source 102 for emitting a second pulsed laser light L2, half-wave plates 104, 105 for respectively changing directions of polarization of the pulsed laser light L1, L2, polarization beam splitters 106, 107 for respectively polarization-separating the pulsed laser light L1, L2 having changed the directions of polarization, and a condenser lens 112 for converging the polarization-separated pulsed laser light L1, L2 at an object to be processed 1. When the directions of polarization of the pulsed laser light L1, L2 changed by the half-wave plates 104, 105 are varied by a light intensity controller 121 in the laser processing apparatus 100, the ratios of the pulsed laser light L1, L2 polarization-separated by the polarization beam splitters 106, 107 are altered, whereby the respective intensities of the pulsed laser light L1, L2 are adjusted.
申请公布号 KR20120037369(A) 申请公布日期 2012.04.19
申请号 KR20117025336 申请日期 2010.08.06
申请人 HAMAMATSU PHOTONICS K.K. 发明人 FUKUMITSU KENSHI
分类号 B23K26/00;B23K26/06;B23K26/067;B23K26/38 主分类号 B23K26/00
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