ELECTRIC POWER CONVERSION APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an electric power conversion apparatus which reduces inductance of a semiconductor module and makes cracks or the like less likely to occur in a resin member of the semiconductor module.

SOLUTION: An electric power conversion apparatus 1 comprises: a semiconductor module 2; a cooler 3; and a metal plate spring 4. The semiconductor module 2 has a semiconductor element 20 composing an electric power conversion circuit and a power terminal 21 connected to the semiconductor element 20. The cooler 3 contacts with the semiconductor module 2, thereby cooling the semiconductor module 2. The plate spring 4 presses the semiconductor module 2 to make the semiconductor module 2 closely contact with the cooler 3. The plate spring 4 includes a pressing part 40 making a surface contact with the semiconductor module 2 and a pair of wing parts 41 formed at the outer side of the pressing part 40. The plate spring 4 is formed by the pair of wing parts 41 and the pressing part 40 so as to protrude toward the semiconductor module 2.

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