发明名称 POSITIVE RESIST COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a resist composition which is stable to a solvent used in an immersion lithography process and has excellent sensitivity and a resist pattern profile. <P>SOLUTION: A positive resist composition comprises: a resin component (A) in which alkali solubility is increased by action of acid; an acid generator component (B) which generates the acid by exposure; an organic solvent (C) which dissolves the (A) component and the (B) component; and a nitrogen-containing organic compound (D). The resin component (A) has (a1) a constitutional unit derived from a (meth) acrylic acid ester having an acid-dissociable dissolution inhibiting group, (a2) a constitutional unit derived from the (meth) acrylic acid ester having a lactone unit, and (a4) a constitutional unit derived from the (meth) acrylic acid ester having a polycyclic group, but does not have (a0) (a0-1) a constitutional unit containing an anhydride of dicarboxylic acid and (a0-2) a constitutional unit containing a phenolic hydroxyl group. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012078864(A) 申请公布日期 2012.04.19
申请号 JP20110284144 申请日期 2011.12.26
申请人 TOKYO OHKA KOGYO CO LTD 发明人 HIRAYAMA HIROSHI;HANEDA HIDEO;FUJIMURA SATOSHI;IWAI TAKESHI;SATO MITSURU;TAKASU RYOICHI;TACHIKAWA TOSHIKAZU;IWASHITA ATSUSHI;ISHIZUKA KEITA;YAMADA TOMOTAKA;TAKAYAMA JUICHI;YOSHIDA MASAAKI
分类号 G03F7/039;G03F7/26;C08F8/12;C08F220/28;G03F7/038;G03F7/38;H01L21/027 主分类号 G03F7/039
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