| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent false recognition of a position of a lead part when a bonding wire is connected to the lead part in a semiconductor device with a lead frame having the lead part connected to a chip mounting part with a wire. <P>SOLUTION: In a lead frame 20 with a chip mounting part, a surface of the chip mounting part 21 and a surface of a lead part 22 are made of the identical material, and amounts of reflection lights of the parts 21 and 22 are different from each other when lights are radiated. When a bonding wire 30 is connected, the lights are radiated to both of the parts 21 and 22, both of the parts 21 and 22 are recognized as visually different from each other due to the difference in an amount of reflection lights between the parts 21 and 22. Under this recognition condition, wire bonding is applied to the lead part 22. <P>COPYRIGHT: (C)2012,JPO&INPIT |
