发明名称 |
Method of predicting reliability of semiconductor device, reliability prediction system using the same and storage medium storing program causing computer to execute the same |
摘要 |
An initial reliability of a semiconductor device is predicted before the design layout of a semiconductor product. A method of predicting the reliability of a semiconductor device according to the present invention: calculates the defect density of a plurality of wiring patterns on a wafer; extracts the critical area of a series of library elements formed of wiring patterns based on the defect density to determine the critical area value of each library element; determines a failure probability by wiring pattern from the result of a reliability test of the wiring pattern to form a correlation model from an expected value in which a defect is generated and which is obtained from the defect density and the failure probability of each wiring pattern; calculates the failure probability of each library element from the critical area value and the function of the correlation model; designs a layout of a semiconductor product with two library elements or more out of a series of the library elements combined together and calculates the reliability of the designed semiconductor device in consideration of the failure probability of the library elements combined together. |
申请公布号 |
US8161428(B2) |
申请公布日期 |
2012.04.17 |
申请号 |
US20090385777 |
申请日期 |
2009.04.20 |
申请人 |
YOKOGAWA SHINJI;RENESAS ELECTRONICS CORPORATION |
发明人 |
YOKOGAWA SHINJI |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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