| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to arrange a seed layer during a pattern groove or a via hole manufacturing process by including metal filler inside of an insulating layer. CONSTITUTION: An insulating substrate includes an insulating layer(130). A plurality of metal fillers(130a) is dispersed in the insulating layer. A plurality of circuit pattern grooves(135) is formed on the surface of the insulating layer. A metal layer is formed on the inner wall of the circuit pattern groove. A plurality of buried circuit patterns(120,140) is arranged on the metal layer.
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