发明名称 ADHESIVE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide an adhesive composition which is excellent in a peelability and also excellent in a product stability even after a high-temperature process. <P>SOLUTION: The adhesive composition contains a hydrocarbon resin, a thermal polymerization inhibitor, a first solvent for dissolving the hydrocarbon resin, and a second solvent which is a solvent for dissolving the thermal polymerization inhibitor and is different from the first solvent, wherein the first solvent and the second solvent are compatible. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012072345(A) 申请公布日期 2012.04.12
申请号 JP20110004952 申请日期 2011.01.13
申请人 TOKYO OHKA KOGYO CO LTD 发明人 IMAI HIROFUMI;TAMURA KOKI;ASAI TAKAHIRO;KUBO ATSUSHI;YOSHIOKA TAKAHIRO
分类号 C09J157/06;C09J7/02;H01L21/304 主分类号 C09J157/06
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