发明名称 SHEET STICKING DEVICE AND SHEET STICKING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a sheet sticking device and a sheet sticking method which can accurately stick an adhesive sheet at a predetermined sticking position on an adherend. <P>SOLUTION: Using a sheet sticking device and a sheet sticking method, an adhesive sheet S can be accurately stuck on a predetermined sticking position on a wafer W. This can be achieved by inserting the adhesive sheet S in a recessed portion 43 of a supporting body 41 of pressing means 4 to prevent a positional shift of the adhesive sheet S with respect to the supporting body 41, and by inserting the wafer W in the recessed portion 43 and sticking the adhesive sheet S onto the wafer W at the same time to prevent a positional shift of the adhesive sheet S also with respect to the wafer W. Further, when sticking the adhesive sheet S onto the wafer W by pressing the same using the supporting body 41 of the pressing means 4, an outer peripheral surface 45 of the recessed portion 43 restricts elongation of the adhesive sheet S so that the adhesive sheet S can be stuck onto the wafer W without spreading out of the wafer W and a predetermined shape thereof can be maintained. This can improve the sticking accuracy of the adhesive sheet S. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012074476(A) 申请公布日期 2012.04.12
申请号 JP20100217279 申请日期 2010.09.28
申请人 LINTEC CORP 发明人 AOKI YOTA
分类号 H01L21/683 主分类号 H01L21/683
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