| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance the efficiency of working after forming a dividing line on a substrate. <P>SOLUTION: A substrate cutting apparatus includes: a substrate placing device having a placing surface where the substrate is placed; a dividing line forming device for forming the dividing line for an exposed surface, which is a main surface of the substrate placed on the substrate placing device, and which is the main surface opposite to a facing surface being the main surface opposed to the placing surface; and a stressing device for stressing the substrate along the dividing line by decompressing a sealing area defined by the facing surface of the substrate and the placing surface of the substrate placing device. <P>COPYRIGHT: (C)2012,JPO&INPIT |
