| 摘要 |
<p>Provided are a multi-cavity wiring board which hardly causes breakage, chipping or cracking from the vicinity of dividing grooves at the time of division or before the division and has high reliability, and a method for manufacturing the same. A multi-cavity wiring board (1) comprises: a product region (4a) configured by stacking a plurality of ceramic layers (s1), (s2), having a front surface (2) and a back surface (3), and provided with a plurality of wiring board parts (4) arranged in a matrix, each of the wiring board parts (4) having a rectangular (oblong) shape in plan view and a cavity (5); an ear part (6) located along the periphery of the product region (4a); and dividing grooves (8), (9) each formed on at least one of the front surface (2) and the back surface (3) along the boundaries between the wiring board parts (4), (4) and the boundaries between the wiring board parts (4) and the ear part (6). In section perpendicular to the longitudinal directions of the dividing grooves (8), (9), a deepest part (8b) of the dividing grooves (8), (9) is in the form of arc, the dividing grooves (8), (9) have an intermediate part (8a) between the deepest part (8b) and a groove entrance (8c), the width (w2) of the deepest part (8b) is larger than the width (w3) of the groove entrance (8c), and the width (w1) of the intermediate part (8a) is the same as or smaller than the width (w3) of the groove entrance (8c).</p> |
