| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of both reducing thickness and achieving high reliability in an area mounting type semiconductor device such as BGA. <P>SOLUTION: There is provided a manufacturing method of a semiconductor device comprising a sealant resin cured body 6 for sealing a substrate 1, a semiconductor element 4, and a connection member and satisfying the following requirements of (1) to (3) and (a), (b). (1) A size of the semiconductor device is 20 mm×20 mm or less. (2) A thickness of the substrate is 300 μm or less. (3) A maximum thickness of the sealant resin cured body from a semiconductor element mounting surface of the substrate is 600 μm or less. (a) A sealant resin composition includes an inorganic filler and an inorganic filler content in the composition is 74 mass% or more and 86 mass% or less. (b) In the case that the inorganic filler content in the sealant resin composition is defined as x (mass%) and a mold shrinkage rate when the sealant resin composition is post cured at 175°C for 4 hours after being molded at 175°C for 90 seconds is defined as y (%), a value of 0.032x+y-2.965 is 0.000 to 0.300. <P>COPYRIGHT: (C)2012,JPO&INPIT |
