| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a shortage of bonding strength between columnar electrodes and solder terminals, and degradation in reliability without using an underfill material. <P>SOLUTION: A semiconductor device comprises: a semiconductor substrate; a plurality of wiring lines provided on the semiconductor substrate; a plurality of solder terminals each connected to the plurality of wiring lines; and a resin layer covering at least portions of the plurality of wiring lines. An overcoat film, which covers at least around the solder terminals, is coated on the resin layer. The height of the overcoat film between the adjacent solder terminals is lower than that of the solder terminals. <P>COPYRIGHT: (C)2012,JPO&INPIT |
