| 发明名称 |
Thermal Compressive Bond Head |
| 摘要 |
A method includes allowing a work piece having a solder bump to contact a bond head; heating the bond head until the solder bump is melted; and conducting a cooling media into the bond head to cool the solder bump and to solidify the solder bump. |
| 申请公布号 |
US2012088362(A1) |
申请公布日期 |
2012.04.12 |
| 申请号 |
US20100901273 |
申请日期 |
2010.10.08 |
| 申请人 |
HWANG CHIEN LING;LIN CHENG-CHUNG;HUANG YING-JUI;LIU CHUNG-SHI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HWANG CHIEN LING;LIN CHENG-CHUNG;HUANG YING-JUI;LIU CHUNG-SHI |
| 分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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