| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which is excellent in heat radiation characteristics and is manufactured without increasing the number of manufacturing processes and the manufacturing cost, and to provide an electronic apparatus including the flexible printed wiring board and a method for manufacturing the flexible printed wiring board. <P>SOLUTION: In a flexible printed wiring board 10 for mounting an exothermic electronic component 20, a heat radiating region R formed by an uneven pattern is provided in a part of a conductive layer 12 provided on both front and rear surfaces of a base substrate 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
