MANUFACTURING DEVICE OF ELECTRONIC COMPONENT PACKAGING BODY

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing device of an electronic component capable of preventing occurrence of an out-of-place error caused by push of an adsorbed electronic component by a subsequent electronic component.

SOLUTION: A manufacturing device of an electronic component packaging body used to supply an electronic component Ch onto a base member on which an electronic circuit is formed comprises: a conveyance path which is provided with a conveyance surface 211a and sequentially conveys the electronic component Ch from the upstream side to the downstream side; and transfer means which adsorbs the electronic component Ch1 which arrived at an adsorption region 211a1 which is a partial region of the conveyance surface 211a and transfers the electronic component Ch to the base member F. When the electronic component Ch1 which arrived at the adsorption region 211a1 is adsorbed to the transfer means, a space S into which a subsequent electronic component Ch2 can enter exists between the previously adsorbed electronic component Ch1 and the conveyance surface 211a.

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