| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a transfer medium and a method of manufacturing a wiring board capable of miniaturizing a conductor circuit pattern formed on the wiring board without complicating steps. <P>SOLUTION: A method of manufacturing a wiring board using a transfer medium 17 in which a conductor circuit pattern 14 was formed on a support substrate 15 via a peelable adhesive agent 16 comprises: a step of crimping the conductor circuit pattern 14 formed on the transfer medium 17 to an interlayer insulation material 18 and a step of peeling the adhesive agent 16, separating the conductor circuit pattern 14 from the support substrate 15, and forming a wiring board 19 by forming the conductor circuit pattern 14 on the interlayer insulation material 18. <P>COPYRIGHT: (C)2012,JPO&INPIT |
