LIGHT EMITTING DEVICE PACKAGE

摘要

PURPOSE: A light emitting device package is provided to improve heat dissipation by using paste with a heat sink function. CONSTITUTION: At least one lead frame is mounted on a body(110). A light source unit is electrically connected to the lead frame. A paste unit(160) is formed in one area of the lead frame and is made of paste with thermal conductivity and adhesion. The light source unit is mounted on the upper side of the paste unit.