发明名称 |
CONDUCTIVE ALUMINUM FILLER, CONDUCTIVE PASTE COMPOSITION INCLUDING THE SAME, AND CONDUCTIVE FILM FORMED USING THE CONDUCTIVE PASTE COMPOSITION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a conductive aluminum filler capable of reducing the amount of hydrogen gas generated by reaction with water, acid or alkali; a conductive paste composition including the same; and a conductive film formed using the conductive paste composition. <P>SOLUTION: The conductive aluminum filler 1 includes an aluminum particle 11 and a phosphoric compound film 12 covering the surface of the aluminum particle 11. The phosphoric compound film 12 preferably contains 0.05 mg/m<SP POS="POST">2</SP>or more and 50 mg/m<SP POS="POST">2</SP>or less of phosphor elements per unit specific surface area of the aluminum particle 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012072441(A) |
申请公布日期 |
2012.04.12 |
申请号 |
JP20100218113 |
申请日期 |
2010.09.29 |
申请人 |
TOYO ALUMINIUM KK |
发明人 |
KAWASHIMA KEI |
分类号 |
B22F1/02;B22F1/00;C09D5/24;C09D7/12;C09D201/00;H01B1/22;H01B5/00;H01B5/14 |
主分类号 |
B22F1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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