发明名称 CONDUCTIVE ALUMINUM FILLER, CONDUCTIVE PASTE COMPOSITION INCLUDING THE SAME, AND CONDUCTIVE FILM FORMED USING THE CONDUCTIVE PASTE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide: a conductive aluminum filler capable of reducing the amount of hydrogen gas generated by reaction with water, acid or alkali; a conductive paste composition including the same; and a conductive film formed using the conductive paste composition. <P>SOLUTION: The conductive aluminum filler 1 includes an aluminum particle 11 and a phosphoric compound film 12 covering the surface of the aluminum particle 11. The phosphoric compound film 12 preferably contains 0.05 mg/m<SP POS="POST">2</SP>or more and 50 mg/m<SP POS="POST">2</SP>or less of phosphor elements per unit specific surface area of the aluminum particle 11. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012072441(A) 申请公布日期 2012.04.12
申请号 JP20100218113 申请日期 2010.09.29
申请人 TOYO ALUMINIUM KK 发明人 KAWASHIMA KEI
分类号 B22F1/02;B22F1/00;C09D5/24;C09D7/12;C09D201/00;H01B1/22;H01B5/00;H01B5/14 主分类号 B22F1/02
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