| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting substrate having improving reliability with suppressed void occurrence and having underfill filled in a short time, in the mounting substrate in which an IC chip connection terminal is electrically connected to a conductor pattern via solder laid on openings formed on a solder resist, and a gap between the solder resist and the IC chip other than the electrical connection portion is filled with the underfill. <P>SOLUTION: A portion of a solder resist 6r coated with underfill 7 includes grooves 9a having a narrower width than the disposition pitch of the connection openings. Each groove 9a is formed between the connection openings in a manner to be stitched into a stripe shape, or to surround the opening in a grid shape, a polygonal shape, a circular shape or an elliptical shape, or to be stitched into a wave shape. The cross sectional shape of each groove 9a is U-shaped, V-shaped or rectangular-shaped. <P>COPYRIGHT: (C)2012,JPO&INPIT |
