发明名称 SPUTTER TARGET
摘要 <P>PROBLEM TO BE SOLVED: To provide a sputter target enabling the formation of a Ti-Al-N film excellent in the property and quality as a barrier film with good reproducibility. <P>SOLUTION: A sputter target is made of a Ti-Al alloy containing Al in the range of 1 to 30 atom%. In the Ti-Al alloy, Al exists in at least one of a solid solution state in Ti and a state in which Al forms an intermetallic compound with Ti. Furthermore, an average crystal grain diameter of the Ti-Al alloy is 500 &mu;m or less, and variation in crystal grain diameter in the entire target is limited within 30%. An average oxygen content of the Ti-Al alloy is 1,070 ppm by weight or lower. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012072496(A) 申请公布日期 2012.04.12
申请号 JP20110227676 申请日期 2011.10.17
申请人 TOSHIBA CORP 发明人 SUZUKI YUKINOBU;ISHIGAMI TAKASHI;KOSAKA YASUO;FUJIOKA NAOMI;WATANABE TAKASHI;WATANABE KOICHI;SANO KENYA
分类号 C23C14/34;C22C14/00;C22F1/00;C22F1/02;C22F1/18;C23C14/06;H01L21/02;H01L21/285;H01L21/768;H01L21/8242;H01L21/8246;H01L27/105;H01L27/108 主分类号 C23C14/34
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