发明名称 |
Printed circuit board and method of manufacturing the same |
摘要 |
A method of manufacturing a printed circuit board is provided. The method includes preliminarily forming a plurality of test pattern layers for detecting the depth of an inner layer in a multilayer printed circuit board such that at least a part of a lower test pattern layer is not overlaid with any upper test pattern layer when viewed from a drill entrance side, and preliminarily forming a surface conductor layer; applying a voltage between the surface conductor layer and the test pattern layers; performing drilling toward one test pattern layer, and detecting a current produced when the drill comes into contact with the test pattern to measure the depth of the layer (D1); performing drilling toward the other test pattern layer, and measuring the depth of the layer (D2); and performing drilling up to just before the conductor-wiring layer based on a depth calculated from D1 and D2. |
申请公布号 |
US8151455(B2) |
申请公布日期 |
2012.04.10 |
申请号 |
US20080143214 |
申请日期 |
2008.06.20 |
申请人 |
HAMADA KAZUNORI;KAWASAKI HIROSHI;OZAKI TOMOAKI;HITACHI VIA MECHANICS, LTD. |
发明人 |
HAMADA KAZUNORI;KAWASAKI HIROSHI;OZAKI TOMOAKI |
分类号 |
H05K3/02 |
主分类号 |
H05K3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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