| 摘要 |
A semiconductor package is provided to coat uniformly an adhesive at a predetermined portion between a semiconductor chip and a substrate and to mount stably the semiconductor chip onto the substrate by controlling the flow of the adhesive in a semiconductor chip mounting process using an adhesive controlling unit. A semiconductor package includes a substrate, a semiconductor chip and an adhesive controlling unit. The substrate(10) includes a solder resist(11) at one side and a through hole(12). The semiconductor chip(20) is connected to the substrate via the solder resist by using an adhesive. The semiconductor chip has a bonding pad(21) corresponding to the through hole of the substrate. The adhesive controlling unit(30) is composed of grooves partially formed on the solder resist. The adhesive controlling unit is capable of controlling the flow of the adhesive. |
