STACKED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A stacked semiconductor package and a manufacturing method thereof are provided to prevent void generation between a substrate and an embedded semiconductor chip, thereby improving reliability of the semiconductor package. CONSTITUTION: A cavity is formed on a part of one surface of a first semiconductor package(110). A first terminal(130) is formed on a part of the upper surface of the first semiconductor package. A second terminal(140) is formed on one surface of a first semiconductor chip(112) which is mounted on the cavity of the first semiconductor package. A second semiconductor package(120) is laminated on the upper part of the first semiconductor package. A second semiconductor chip(122) which is mounted on a cavity of the second semiconductor package includes the second terminal on one surface of the second semiconductor chip.