| 摘要 |
PURPOSE: A method for manufacturing a printed circuit board and a printed circuit board are provided to improve the degree of freedom of the design of a circuit pattern by forming the structure of a bump, which connects a circuit inter-layer, into a stepped structure in the same insulating layer. CONSTITUTION: A metal layer(120) is formed on the top of a first insulation layer(110)(S1). An internal circuit pattern(121) is formed by patterning the metal layer(S2). The first insulation layer uses an epoxy, a phenol resin, a prepreg, a polyimide film, a ABF(Ajinomoto Build up Film). A first bump(130) is formed on the top of the internal circuit pattern(S3). A second insulation layer is laminated on the top of the first bump(S4). A second bump area is formed by processing the second insulation layer. A second bump is formed by filling a metal material in the second bump area(S5). A plating process is performed in the front side of the second insulation layer to form a second metal layer(160). An external circuit pattern(161) is formed by patterning the second metal layer.
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