发明名称 FLEXIBLE SUBSTRATE, PACKAGING METHOD OF FLEXIBLE SUBSTRATE AND LUMINAIRE
摘要 <P>PROBLEM TO BE SOLVED: To provide a flexible substrate on which electronic devices can be arranged precisely in a desired configuration without complicating a structure and a production process of components, and to provide a packaging method of the flexible substrate, and a luminaire. <P>SOLUTION: The flexible substrate comprises a belt-like substrate body, a comb-shaped part consisting of multiple protrusions extending from one end of the substrate body in a direction perpendicular to the longitudinal direction thereof toward a direction perpendicular to the longitudinal direction, and electronic devices respectively arranged in the multiple protrusions. The substrate body and the comb-shaped part can be flexed and deformed. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012069673(A) 申请公布日期 2012.04.05
申请号 JP20100212395 申请日期 2010.09.22
申请人 SONY CORP 发明人 KAWABE HIDEO;CHOKAI YOICHI;KABASAWA KENICHI;SUZUKI TATSUYA;IMAI HIROKAZU;UENO MASATOSHI
分类号 H05K1/02;F21S2/00;F21V19/00;F21V23/00;F21Y101/02;H05K1/18 主分类号 H05K1/02
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