| 摘要 |
<p>#CMT# #/CMT# Controlling layer thickness during the coating of substrates (2) in vacuum, comprises determining growth of the layer on a substrate in a vacuum coating system (1), where the substrate is weighed in situ in vacuum, after the coating method, and the layer growth is determined with the weight value and the weight value of previous measurements. #CMT# : #/CMT# An independent claim is also included for a device for carrying out the above mentioned the method, comprising a support arranged in a vacuum chamber of the vacuum coating system for the substrate with the support plane, where a balance is arranged in the vacuum chamber, and the balance exhibits a substrate opposite side (11) form a support plane (10) penetrating through a force holding means (12). #CMT#USE : #/CMT# The method is useful for controlling layer thickness during the coating of substrates in vacuum. #CMT#ADVANTAGE : #/CMT# The method is carried out with high accuracy and without affecting productivity of the coating. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The figure shows a schematic representation of the device. 1 : Vacuum coating system 2 : Substrate 10 : Support plane 11 : Substrate opposite side 12 : Force holding means #CMT#INSTRUMENTATION AND TESTING : #/CMT# Preferred Method: The layer thickness reached in the coating method is determined from the difference of the weight value before and after the coating method. Preferred Components: The substrate moving into a transport direction is weighed during its movement. The substrate, which is placed on a carrier, is transported by means of the carrier. The substrate is lifted from its support during weighing. A wafer as a substrate is insertable in the carrier as a part of a transportation device, which is movable by means of a carrier drive and exhibits the support plane. The wafer is weighed by the balance in the carrier moving without interruption, after each coating method. The force holding means of the balance is positioned in a starting position under the wafer and is moved with the same speed as the carrier and in synchronism with it. The wafer, after positioning the force holding means of the balance under the wafer by weighing the same, is withdrawn by the force holding means. The wafer is placed back onto the carrier, after the weighing, and the force holding means of the balance is driven back into the starting position for the next weighing. The force holding means is moved together with the balance. The force holding means prior to the lifting and prior to lowering is positioned accurately to the carrier through an optical measurement system. The measurement signal of the weighing is transmitted in a control of the vacuum coating system, and the coating method is controlled corresponding to the layer thickness determined through measurement. The force holding means is arranged at the substrate moving on the transportation device with the substrate, which is synchronously movable. The force holding means is movable between the starting position and an end position with the same speed and synchronously to the carrier and between a lifting position, in which the force holding means penetrates the support plane, and a lowered position, in which the force holding means present under the support plane, is perpendicularly movable to the support plane. The force holding means is placed on a carriage moving under the carrier with the same speed as the carrier. The carriage is provided with a lifting device moving the force holding means perpendicular to the support plane.</p> |
