| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board in which projection or detachment of a through conductor arranged on an insulating plate can be minimized. <P>SOLUTION: The wiring board is produced by forming a through conductor 2 in an insulating plate 1 consisting of sintered ceramic to penetrate the insulating plate 1 in the thickness direction. The through conductor 2 is formed to fill a conductor material 4 internally having a non-filled part 5 into a through hole 3 to penetrate the insulating plate 1 in the thickness direction. Thermal expansion of the through conductor 2 can be absorbed by the non-filled part 5, and projection of the through conductor 2 from the main surface of the insulating plate 1 to the outside or detachment of the through conductor 2 from the through hole 3 can be minimized. <P>COPYRIGHT: (C)2012,JPO&INPIT |
